Our high-speed needle dispensing valves eliminate voids and bridging in chip bonding processes, delivering exceptional first-pass yield performance for advanced IC packaging applications.
Ultra-compact design for glue dispensing in confined spaces (≤5mm²)
Zero-residue shutoff ensures clean glue cut-off every time
Precise flow control with 0.001ml/s adjustable dispensing
Non-contact & contact modes for versatile bonding/coating
100Hz high frequency operation: high-speed precision needle valve design improves dispensing machine efficiency by 5 times