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To ensure the long-term reliability of IGBT vehicle power modules, the glue filling process is critical. The real challenge? Eliminating bubbles completely to prevent hidden risks.
The process runs in three steps:
· The vacuum pump of the GV334 pulls the potting cavity to the set vacuum level, removing air in advance.
· The FD2000 two-component screw valve then outputs epoxy potting glue at the set ratio.
· Finally, the well-mixed glue is injected directly into the IGBT module inside the GV334 vacuum cavity.
The vacuum environment, combined with the smooth delivery of the screw valve, effectively avoids bubble entrainment and residue. The result? Epoxy glue fully fills the internal gaps of the module — achieving true bubble-free potting.
What does bubble-free potting mean for IGBT modules?
· Higher insulation reliability
· Better heat dissipation uniformity
· Greater vibration resistance
These are the foundations for long-term stable operation of new energy vehicle power modules.
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